Huawei Tipped to Announce a New Chipset Based on New Packaging Technology This Year

Huawei is reportedly working on a new chipset designed using a new packaging technology. It has also been tipped that the preparations for Huawei Mate X3 foldable smartphone will begin in a couple of days.

from Gadgets 360 https://ift.tt/JBP6ak4

Comments

Popular posts from this blog

The First Omen (English)

Snapdragon 7 Gen 2 SoC Specifications Surface Online, Tipped to Feature Tri-Cluster Design